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Description
Schneider Electric 140CRA21110C Single-Port Drop InterfaceSchneider Electric 140CRA21110C DIO Drop Interface The 140CRA21110C is a remote I O drop interface module for Schneider Electric's Modicon Quantum distributed I O system. This module acts as the power supply and communication gateway for a remote I O drop, connecting it to the Quantum head end controller over a Modbus Plus network. Technical Specifications Brand & Model: Schneider Electric 140CRA21110C Product Type: DIO (Distributed I O) Drop
Schneider Electric 140CRA21110C DIO Drop Interface
The 140CRA21110C is a remote I/O drop interface module for Schneider Electric's Modicon Quantum distributed I/O system. This module acts as the power supply and communication gateway for a remote I/O drop, connecting it to the Quantum head-end controller over a Modbus Plus network.
Technical Specifications
- Brand & Model: Schneider Electric 140CRA21110C
- Product Type: DIO (Distributed I/O) Drop Interface
- System Platform: Modicon Quantum Automation Platform
- Network Ports: 1 single Modbus Plus (RS-485) network port
- Supply Voltage: Wide range 85-276 V AC (115/230 V AC nominal)
- Supply Frequency: 47-63 Hz
- Rated Power: 50 VA
- Output Power: 5.1 V DC at 3 A for powering I/O modules in the drop
Electrical Characteristics
- Maximum Supply Current: 0.2 A @ 115V AC / 0.4 A @ 230V AC
- Inrush Current: 10 A @ 115V AC / 20 A @ 230V AC
- Fuse Protection: 1.5 A internal fuse
- Minimum Load: 0 A (can operate with no I/O modules attached)
- Protections: Short-circuit and Output overvoltage protection
- Power Dissipation: 11 W
- Terminal Connection: 7-pole terminal block for power and network
I/O & System Capacity
- I/O Word Capacity: 30 Input words / 32 Output words per drop
- Supported Backplanes: Interfaces with Quantum drop backplanes of 2, 3, 4, 6, 10, or 16 module positions
- Diagnostics: Continuous checksum, RAM, and RAM address diagnostics during startup and runtime
- Function: Manages all data exchange between the Quantum head-end controller and the I/O modules in its local drop
Environmental Durability
- Operating Temperature: 0 to 60 °C (32 to 140 °F)
- Storage Temperature: -40 to 85 °C (-40 to 185 °F)
- Humidity: Up to 95% non-condensing
- Operating Altitude: Up to 5000 meters (16,404 ft)
- Protection: Conformal coating (Humiseal 1A33) and TC treatment
- ESD Immunity: 4 kV (contact), 8 kV (air) per IEC 801-2
- EMC Immunity: 10 V/m (80-2000 MHz) per IEC 801-3
Certifications & Standards
- Safety: UL 508 listed
- Hazardous Location: CSA Class 1 Division 2
- Marine: DNV certified
- Regional: GOST, C-tick approvals
Physical & Packaging Details
- Module Format: Standard Quantum module size for drop mounting
- Net Weight: Module weight approximately 0.7 kg (1.5 lb)
- Unit Package (PCE): 1 module per box.
- Package Dimensions: 31.0 cm L x 16.5 cm W x 5.0 cm H (12.2" x 6.5" x 2.0").
- Package Weight: 702.0 g (24.8 oz).
Packaging & Shipping
- The 140CRA21110C interface module ships individually in protective packaging.
- Worldwide express shipping via FedEx, UPS, and DHL available.
Frequently Asked Questions (FAQ)
- What is a DIO drop interface? It is the controller for a remote I/O station ("drop") in a Quantum distributed I/O network. It handles communication with the main PLC and powers the local I/O modules.
- What voltage does it accept? It accepts a wide range of 85-276 V AC, making it suitable for most global single-phase power supplies without a transformer.
- What does it power? Its 5.1V/3A output supplies power to the Quantum I/O modules installed in the same drop's backplane.
- How many I/O modules can it support? The number depends on the backplane size (2-16 slots) and the power consumption of each I/O module. The 3A output is the limiting factor.
- What network does it use? It connects to the Quantum head-end module (e.g., 140NOM21100C) via a single Modbus Plus (RS-485) network.
- What are the diagnostics for? The continuous RAM and checksum diagnostics ensure the integrity of the module's operation and data, critical for reliable remote I/O.
- Is it the same as a remote I/O adapter? Yes, "DIO drop interface," "remote I/O adapter," and "remote I/O processor" are often used interchangeably for this type of module.
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